Solar Scriber Machine

Name: Solar Scriber Machine
Brand: STARLASE SYSTEMS PVT. LTD.

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MOQ : 1 Unit

Solar Scriber Machine Specification

Marking Area
700 mm x 700 mm

Marking Speed
6000 mm/min

Condition
New

Laser Type
Diode Laser

Cooling Mode
Water Cooling

Control Software
Custom PLC / HMI

Accuracy
0.02 mm

Power
80 W

Dimensions
1200 mm x 800 mm x 1500 mm

Solar Scriber Machine Trade Information

Minimum Order Quantity
1 Unit

Supply Ability
10 Units Per Month

Delivery Time
1 Months

Main Domestic Market
Daman and Diu, Madhya Pradesh, Rajasthan, Gujarat

About Solar Scriber Machine

Solar Scriber is a compact lab machine used in scribing and cutting of metals, germanium gallium arsenide and various other substrate material. It is designed for flexibility and mainly suited for determining optimal process parameters for different productions. This machine is equipped with various laser sources, pulse length and various optical configuration and mechanical head. We have two models of Solar Scriber Machine Semiconductor Diode and laser generation by Semiconductor Diode with Water cooling System.

Model	SSD50 / 75	SSF10 / 20
Laser	DP	Fiber
Wavelength	1064 nm	1060 - 1070 nm
Average Power	50W / 75W	10W / 20W
Beam Quality	< 3 M² / <5 M²	< 1.6 M²
Kerf Width	0.05/ 0.06 mm	0.03 mm
Cutting Accuracy	0.01 mm	0.01 mm
Max Thickness	0.7mm / 0.8 mm	0.7mm / 1.2 mm
Cutting Speed	120mm/s ( programmable )	100mm/s ( programmable )
Power Consumption	< 1.5 KW <	800 W
Power Requirement	220 VAC / 50 HZ / 15A	220 VAC / 50 HZ / 10A
Dimensions	1500 x 750 x 1580 mm	780 x 750 x 1570 mm
Weight	150 kgs	160 kgs

Advanced Scribing Technology for Solar Cell Manufacturing

Equipped with a diode laser and CNC functionality, the Solar Scriber Machine uses linear guideways to deliver rapid, precise cuts through glass and silicon wafer material. Its water cooling system ensures optimal performance during continuous operations, making it a valuable asset for demanding fabrication lines.

User-Friendly Interface and Safety Features

Operators benefit from a responsive touch screen interface paired with protective covers that interlock automatically. The custom PLC/HMI software provides granular control and monitoring, ensuring both safety and ease of use, even in high-throughput settings.

FAQs of Solar Scriber Machine:

Q: How does the Solar Scriber Machine achieve high precision in glass and silicon wafer scribing?

A: This machine utilizes diode laser technology and a precision motion system based on linear guideways, allowing for accurate cuts within a tolerance of 0.02 mm. The stability and control provided by its CNC and custom PLC/HMI software further enhance scribing precision.

Q: What materials can the Solar Scriber Machine process?

A: The machine is designed to handle both glass and silicon wafer substrates, commonly used in solar cell manufacturing. Its adjustable scribing thickness range from 0.2 mm to 4 mm ensures compatibility with various material specifications.

Q: When is it recommended to use the custom pattern cut feature?

A: Custom pattern cutting is advisable when specialized designs or intricate shapes are needed for specific solar cell configurations, allowing for greater flexibility and optimization of cell layouts during the production process.

Q: Where can the Solar Scriber Machine be installed and operated?

A: Suitable for laboratories, manufacturing facilities, and industrial workshops, this machine operates best in controlled environments with ambient temperatures ranging from 15-30C, as specified for optimal cooling and performance.

Q: What is the process for operating the scribing machine?

A: Users set up scribing parameters via the touch screen interface, select material type and thickness, choose cut patterns, and let the automatic mode execute the operation. The water cooling system and interlocked protective cover ensure continuous safe operation.

Q: What are the main benefits of using this Solar Scriber Machine in solar cell production?

A: Key advantages include exceptional cutting accuracy, flexible pattern selection, user-friendly controls, robust safety features, and high marking speed, resulting in improved throughput and reduced material waste for manufacturers.

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